MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Nanoscience and Technology)
| Author | : | |
| Rating | : | 4.36 (806 Votes) |
| Asin | : | 0071455566 |
| Format Type | : | paperback |
| Number of Pages | : | 220 Pages |
| Publish Date | : | 2017-01-03 |
| Language | : | English |
DESCRIPTION:
Gilleo resides in Warwick, Rhode Island. patents, and his products have received three R&D 100 Awards. Gilleo has 30 U.S. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). The firm’s projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. He has been actively involved in the dev
George Riley said Better Packaging Solutions. "MEMS/MOEMS Packaging" is an unusual, perhaps even a deceptive book. It might be mistaken for only a broad technology survey, covering in detail the present state of MEMS packaging. Under that guise, Dr. Ken Gilleo provides a well-structured explanatory tou
From the Back CoverAUTHORITATIVE, COST-EFFECTIVE SOLUTIONS FOR MEMS AND MOEMS ASSEMBLIES This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including: Wafer-level packaging Microfluidic device packaging Optical MEMS packaging RF and microwave packaging Laser sealing Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues. CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING & ASSEMBLY PROBLEMS:Engineering fundamentals of packaging for MEMS and MOEMS devices Principles, materials, and fabrication of MEMS and MOEMS devices Evaluation methods for MEMS and MOEMS packaging challenges MEMS packaging processes From MEMS
One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs