Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

^ Read ^ Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari, Dale W. Swanson ↠ eBook or Kindle ePUB. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test pro

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications)

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Rating : 4.76 (616 Votes)
Asin : 0815515138
Format Type : paperback
Number of Pages : 475 Pages
Publish Date : 2015-03-14
Language : English

DESCRIPTION:

"Getting stuck with the right adhesives." according to George Riley. "Adhesives Technology for Electronic Applications" is the first book dedicated exclusively to the electronic applications of adhesives. It leaves no need for another such book, at least until this generation gives way to nano or other adhesives. It is many books in one: textbook, handbook, reference book, catalog, history book. Together, all exhaustively cover the what, why, and how of

"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley

And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms.

In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. Each chapter provides comprehensive references.. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment

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